Research group of Suga has studied several combination of similar- and dissimilar-material bonding (Si/Si, Al/Al, Cu/Cu, Si/SiO 2 ) using the surface activation method. For achieving the general trend of temperature reduction during microelectronic fabrication, room-temperature or lower-temperature adhesion improvement is required. However, it should be noted that these studies required heat treatment during/after deposition. These studies mentioned above indicate that the effective adhesion layers contain elements that are easily oxidizable and miscible in Cu. Other elements, such as Al, Ti, and Cr, added to Cu were studied previously, and they were reported to improve the adhesion strength between Cu and various substrates (not only glass). reported the formation of interfacial layer by annealing in Cu-Mg/glass and showed that the adhesion strength improved by formation of a Mg oxide layer at the interface. have investigated the interfacial properties of the annealed Cu-Mn/glass structure and reported that adhesion improvement was observed by formation of a several nm thick Mn oxide layer at the interface. In addition, reactions between Cu and those metals can lead to a significant increase in resistance when the Cu film is thin.

However, this technique is not very useful in three-dimensional MEMS/packaging, because these metals must be deposited with sequential high-vacuum deposition methods, which do not give a good step coverage. It is a common sense in vacuum engineering to insert a reactive metal such as Al or Ti between Cu and glass. One of the solutions for strengthening the interface bonding is the formation of an adhesion layer between a Cu film and a glass substrate. Therefore, atomically scaled interface bonding is demanded for fabricating a highly reliable Cu/glass structure. The brittle layer produced at the interface lowers the mechanical strength of the joint. Also, these fusion welding and solid-state welding methods usually produce thick brittle intermixing layer such as intermetallic compound with a scale of micrometers or larger. Therefore, brittle materials such as glass and silicon wafer are broken when the solid-state welding methods are applied for the MEMS stacks. For acceleration of the atomic diffusion, friction is usually generated between the welding materials. However, atomic diffusion for achievement of joining needs to be accelerated at solid state. These methods have no high energy comparing with the fusion welding because these methods are achieved for joining at solid state. Recently, solid-state welding methods such as friction stir welding and magnetic pulse welding are developed. In the field of structural materials, fusion welding such as arc welding and laser welding is usually applied for dissimilar-metal or dissimilar-material welding, but in these welding methods, extremely high energy are needed for melting of metals, and it is difficult for joining of micrometer-scale or nanometer-scale precision. Prepare for the Microsoft MCSD: App Builder exam anytime, anywhere in PDF format.In microelectromechanical system (MEMS) and packaging technologies, high reliability of Cu metallization of glass substrates is strongly required.Validate preparation and know mistakes before the real Microsoft MCSD: App Builder certification exam with practice exams.Acquire extensive knowledge of each topic in the Microsoft certification exam syllabus.Prepare with questions that are actually part of the current Microsoft MCSD: App Builder certification exam.This is a golden opportunity to become Microsoft MCSD: App Builder certified professional: We assure you that you will pass your required Microsoft MCSD: App Builder exam without any difficulty. Whether it's a PDF, web-based, or desktop practice exam, CertificationsBuzz provides you with content that matches the current Microsoft MCSD: App Builder syllabus of the exams. Passing Microsoft Certification Exams is a piece of cake as long as you prepare with CertificationsBuzz preparation materials.Įxtensive knowledge of each topic in the syllabus is available in all three product formats.

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